EE Times: IBM water cools 3D chips
IBM's Zurich Research Laboratory on Thursday (June 5) demonstrated three-dimensional chip stacks that are cooled with water.
The link address is: http://www.eetimes.com/showArticle.jhtml?articleID=208402316
EE Times: IBM water cools 3D chipsIBM's Zurich Research Laboratory on Thursday (June 5) demonstrated three-dimensional chip stacks that are cooled with water. The link address is: http://www.eetimes.com/showArticle.jhtml?articleID=208402316 |
This site conforms to the following standards: